Blog

We are pleased to announce our successful participation in CHINAPLAS 2025, held at the Shenzhen World Exhibition & Convention Center.

During the four-day event, our team showcased the latest flexographic printing technologies, intelligent bag-making systems, and complete packaging solutions. We engaged with a wide range of visitors from different industries, discussed innovative packaging needs, and explored new opportunities for global collaboration.

Our booth attracted considerable attention thanks to our commitment to precision engineering, efficient production solutions, and customer-centric service. We were honored to meet many new partners and reconnect with long-term clients who have supported us throughout the years.

CHINAPLAS 2025 provided a valuable platform for exchanging ideas and expanding future cooperation opportunities. We sincerely thank everyone who visited our booth and look forward to deepening our collaboration in the coming months.

Stay tuned for more updates as we continue to deliver high-quality flexographic printing solutions worldwide.